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TE Connectivity AMPMODU 1.0mm Centerline Interconnect System

TE Connectivity's (TE) AMPMODU 1.0mm Centerline Interconnect System offers an 85% space savings on the board when compared to the standard 2.54mm pitch connectors. A dual-beam contact design provides a reliable electrical connection even in severe shock/vibration environments. TE AMPMODU 1.0mm Centerline Interconnect System serves a broad range of design requirements with up to 100 positions and two plating options with support for automated surface mounting and reflow processes.

Features

  • 85% space savings on PCB with 1.0mm centerline as compared to the 2.54mm (0.100") connectors
  • Reliable signal transfers through two points of contact even in severe shock/vibration applications
  • Manufacturing flexibility in an automated environment with surface mount configuration with pick and place cap
  • Improved durability and corrosion resistance with gold plating
  • Time savings thanks to reflow capable materials
  • Greater flexibility in the assembly of boards with dual entry receptacles
  • RoHS and REACH compliant

Applications

  • Industrial controls
  • Building and home automation devices
  • Servo drives
  • Programmable logic controllers (PLC)
  • I/O devices
  • Telecommunication equipment
  • Robotics
  • Instrumentation and test equipment

Specifications

  • 1.0mm (0.0394") centerline
  • SMT
  • Vertical mounting angle
  • Dual-beam receptacle contact design
  • Dual-entry receptacle
  • Double row, 5 to 50 positions per row
  • Electrical
    • 1A maximum current per contact
    • 30VAC operating voltage
    • 300VAC dielectric withstanding voltage
  • Mechanical
    • -55°C to +125°C operating temperature range
    • Re-flow solder-capable up to +260°C
  • Materials
    • High-temperature LCP thermoplastic housing
    • Copper alloy contacts
    • Plating options
      • 30µ" (0.76µm) gold
      • 5µ" (0.1µm) gold flash

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Additional Resources

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TE Connectivity AMPMODU Interconnection System

Provides connections with a unique modular concept, utilizing precision-formed receptacle contacts.

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Published: 2021-08-02 | Updated: 2025-03-17