SkyHigh Memory 3.3V e.MMC Flash Memory Devices
SkyHigh 3.3V e.MMC Flash Memory Devices are managed NAND memory solutions designed for embedded applications. These e.MMC devices include a flash controller and standard MLC NAND flash memory and are compatible with the JEDEC JESD84-B51 with backward compatibility to the previous e.MMC specifications. They are designed for faster throughput and large data transfer, 3.3V e.MMC devices offer high performance, great reliability, and minimal latency. Flash memory offers optimum power management features that reduce power consumption, making it an ideal solution for mobile applications.Highly optimized SkyHigh firmware fully utilizes the MLC NAND capabilities, leveraging wear-leveling, defect management, garbage collection, and ECC to enhance product life. The e.MMC family offers a vast array of the JEDEC e.MMC features. These features include HS200, HS400, high priority interrupt (HPI), boot partitions, RPMB partitions, background operations, hardware reset, and power off notification. They are combined with an advanced e.MMC devices are ideal for industrial applications, set-top boxes, gaming consoles, and consumer electronic devices.
Features
- e.MMC 5.1 specification compatible
- Backward compatible with the previous e.MMC specifications
- Operating voltage
- VCCQ : 1.7V to 1.95V or 2.7V to 3.6V
- VCC : 2.7V to 3.6V
- Density: 4GB, 8GB, or 16GB of data storage
- Data bus width
- SDR Mode: 1-bit, 4-bit, 8-bit
- DDR Mode: 4-bit, 8-bit
- HS200 Mode: 4-bit, 8-bit
- HS400 Mode: 8-bit
- Clock frequency: 52MHz, 200MHz
- SDR Mode: up to 52MHz
- DDR Mode: up to 52MHz
- HS200 Mode: up to 200MHz
- HS400 Mode: up to 200MHz
- BGA packages
- 153-ball VFBGA (9mm x 7.5mm x 0.8mm)
- Operating temperature range
- Industrial (–40°C to +85°C)
- Commercial (0°C to +70°C)
- –40°C to +85°C storage temperature range
Applications
- Embedded systems
- Settop boxes
- Industrial automation
- Routers and switches
- Internet of Things (IoT)
- Gaming consoles
- Consumer electronic devices
Published: 2020-03-06
| Updated: 2024-08-30
