NXP Semiconductors A5M36TG140TC-EVB Top-Side Cooling Evaluation Board
NXP Semiconductors A5M36TG140TC-EVB Top-Side Cooling Evaluation Board allows for thinner 5G massive MIMO radios. The NXP Semiconductors A5M36TG140TC-EVB removes the need for the dedicated RF shield and separates thermal management from RF design. The first family of NXP top-side cooled devices are designed for 64T64R (320 W) or 32T32R (200 W) mMIMO radios covering 3.3GHz to 3.8GHz.
Features
- Reduces radio thickness and weight
- Enables fewer and shorter connectors
- Removes the need for top-side RF shielding
- Cleaner separation of thermal and RF paths
- Lower thermal resistance
Applications
- Communication Infrastructure
- 5G massive MIMO radio units (typically 64T64R 320W or 32T32R 200W)
- Drivers for high-power macro base stations
- Open RAN and proprietary radio access networks
- Outdoor small cells
Additional Resources
Published: 2023-08-14
| Updated: 2023-08-25