Bergquist Company Data Center Applications
Bergquist Company Data Center Applications feature advanced materials that help with thermal management, long-term reliability, and stress protection. Data center speeds and volumes are growing as analytics, artificial intelligence (AI), and high-performance computing go mainstream. This increased demand is causing next-generation data centers to run hotter, and this heat can degrade performance. Bergquist Company designs and manufactures component-level thermal management and stress protection products, which help meet these heightened performance requirements.
Thermal GAP PAD® Materials
GAP PAD Family Microsite
TGP HC3000 Series, 3W/m-K, High Compliance Soft
TGP HC5000 Series, 5W/m-K, Highly Conformable Soft
TGP 3000ULM Series, 3W/m-K, Extremely Soft
TGP 3500ULM Series, 3.5W/m-K, Extremely Soft
TGP 6000ULM Series, 6W/m-K, Extremely Soft
TGP 7000ULM Series, 7W/m-K, Extremely Soft
TGP 10000ULM Series, 10W/m-K, Extremely Soft
TGP 12000ULM Series, 12W/m-K, Extremely Soft
Thermal Phase Change Materials
Hi-Flow THF 1600G Series, 1.6W/m-K
Hi-Flow THF 5000UT Series, 5.3W/m-K
Thermally Conductive Adhesives
Liqui-Bond TLB 400SLT Series, 4W/m-K
Liqui-Bond TLB EA1800 Series, 1.8W/m-K
Liqui-Bond TLB SA3500 Series, 3.5W/m-K
Videos
Application Example
Application Areas
Featured Applications
Bergquist Company Router Switch & Network Applications
Materials and adhesives designed to dissipate heat away from thermally sensitive components.
Bergquist Company Server Applications
Thermal management products designed for a wide range of use, no matter how many servers are used.
Bergquist Company Storage Applications
Advanced materials for storage hardware that increase reliability, stability, and transfer rates.
Related Products
Loctite Data Centre Applications
Advanced materials help with thermal management, long-term reliability, and stress protection.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Bergquist Company GAP PAD® Thermally Conductive Materials
Interface materials with greater conformability, higher thermal performance, and easier application.
Bergquist Company TGP HC5000 Highly Conformable GAP PAD®
Silicon-based 5.0 W/m-K high compliance GAP PAD is non-electrically conductive & highly conformable
Bergquist Company TGP 6000ULM 6W/m-K, High Performance GAP PAD®
Soft gap-filling materials with 6W/m·K thermal conductivity for high-performance applications.
Bergquist Company TGP 7000ULM 7W/m-K, Extremely Soft GAP PAD®
Soft gap-filling materials with 7W/m·K thermal conductivity for high-performance applications.
Bergquist Company TGP 10000ULM 10W/m-K Extremely Soft GAP PAD®
UL94V-0 flammability rating, 10W/m-K thermal conductivity, and -60°C to +200°C temperature range.
Bergquist Company TGP 12000ULM 12W/m-K, Extremely Soft GAP PAD®
High thermal conductivity and ultra-low modulus TIM for use in modern datacom applications.
Bergquist Company Liqui-Form TLF 3800LVO Liquid Formable Gel
Offers low volatility, low assembly stress, and high thermal conductivity for high reliability.
Bergquist Company Liqui-Form TLF 6000HG 6W/m-K Liquid Formable Gel
Designed to meet performance needs of next-generation 5G base station and remote antenna systems.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.