Advanced Thermal Solutions BGA High-Performance Heat Sinks for NXP
Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.
Features
- Fabricated from extruded aluminum
- Low profile spread fin array
- maxiGRIP™ heat sink attachment
- High performance, phase change thermal interface material
Applications
- Flip-chip processors
- Linux board support packages (BSPs)
- Integrated communications processors
- Host and integrated host processors
View Results ( 10 ) Page
| Part Number | Datasheet | Thermal Resistance | Length | Width | Height |
|---|---|---|---|---|---|
| ATS-59007-C1-R0 |  |
2.42 C/W | 46 mm | 35 mm | 16 mm |
| ATS-59001-C1-R0 | |
4.5 C/W | 45 mm | 21 mm | 11 mm |
| ATS-59002-C1-R0 | |
6.5 C/W | 32 mm | 25 mm | 13 mm |
| ATS-59005-C1-R0 | |
6.2 C/W | 37 mm | 29 mm | 10 mm |
| ATS-59008-C1-R0 | |
2.42 C/W | 46 mm | 35 mm | 16 mm |
| ATS-59000-C1-R0 | |
6.1 C/W | 45 mm | 21 mm | 9 mm |
| ATS-59003-C1-R0 | |
3.8 C/W | 50 mm | 32 mm | 12 mm |
| ATS-59004-C1-R0 | |
3.2 C/W | 55 mm | 43 mm | 12 mm |
| ATS-59006-C1-R0 | |
6.2 C/W | 37 mm | 29 mm | 11 mm |
| ATS-59009-C1-R0 | |
3.2 C/W | 62 mm | 52 mm | 13 mm |
Published: 2013-03-18
| Updated: 2020-12-15