ADLINK Technology Express-RLP COM Express Basic Size Type 6 Modules
ADLINK Technology Express-RLP Modules are Type 6 basic size modules based on the 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P). The Express-RLP is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 performance cores and 8 Efficient-cores) provided with industrial-grade/real-time options to deliver superior performance for edge IoT innovations across varied power ranges at 15W/28W/45W TDP. The module supports PCIe 4.0 and DDR5 memory with up to 4800MT/s, four displays or USB4/TBT4, and offers integrated Intel Iris Xe graphics with up to 96EUs, enabling instantaneous on-device AI performance.
The ADLINK Express-RLP Modules are supplied with Intel TCC (Time-Coordinated Computing) and TSN (Time-Sensitive Networking) support. This support permits the timely execution of deterministic, hard real-time workloads with ultra-low latency, making the Express-RLP ideal for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, and video broadcasting.
Features
- COM Express Rev. 3.1
- Additional Real-time / Industrial SKUs (14C/20T)
- Up to 64GB DDR5 SO-DIMM at 4800MT/s, IBECC
- AI inferencing (AVX-512 VNNI, Intel Iris® Xe)
- PCIe Gen4, 4x displays / 2x USB4
Specifications
- 13th Gen Intel Core mobile processor (Raptor Lake-P)
- Up to 14 cores (6 P-cores and 8 E-cores), 20 threads
- Intel AVX-512 VNNI, Intel DL Boost
- Intel Iris Xe graphics
- 4x displays via DDI/LVDS (optional eDP, VGA) or 2x USB4/TBT4
- Up to 64GB DDR5, in-band ECC, at up to 4800MT/s
- 16x PCIe Gen4, 5x PCIe Gen3 lanes
- 2.5GbE, Intel TCC, TSN capable
- Extreme rugged operating temperature option
Associated Kit
ADLINK Technology COM Express Type 6 Starter Kit
Intended for testing and verification of COM Express systems based on Type 6 modules.
Block Diagram
Layout
Videos
Published: 2024-05-14
| Updated: 2024-06-03