Infineon Technologies HybridPACK™ Drive G2 Modules
Infineon Technologies HybridPACK™ Drive G2 Modules are compact power modules designed for hybrid and electric vehicle traction. The Infineon Technologies G2 modules offer scalable performance levels using Si or SiC technologies and different chipsets, maintaining the same module size. Introduced in 2017 with silicon EDT2 technology, it was optimized for efficiency in real-world driving. In 2021, a CoolSiC™ version was introduced, offering higher cell density and better performance. In 2023, the second generation, HybridPACK Drive G2, was launched with EDT3 (Si IGBT) and CoolSiC™ G2 MOSFET technologies, providing ease of use and integration options for sensors, enabling up to 300kW performance within 750V and 1200V classes.
Features
- HybridPACK Drive G2 Si IGBT
- EDT3 750V and EDT(1) 1200V technologies with improved thermal stacks
- Long AC tabs optional, to enable current sensing
- Lower AC contact resistance and increased tab thickness (1.5mm)
- Improved pin rivet ensuring high robustness over the entire temperature range
- PinFin baseplate for direct cooling
- Die attach technology with sintering
- High robustness over the entire temperature range
- Supports continuous operating temperature at +175°C and peak at +185°C (FS1150, FS1300)
- >900ARMS continuous possible (Gen1 ~550ARMS)
- Improved thermal conductivity
- Increased durability, especially in harsh environments
- HybridPACK Drive G2 SiC
- ATV CoolSiC™ Trench MOSFET Gen2
- Enhanced package (sintered, performance ceramic)
- PinFin baseplate for direct cooling
- Supports continuous operating temperature at +175°C
- Supports peak operating temperatures at +190°C
- Improved pin rivet
- High robustness over the entire temperature range
- Long AC tabs are optional, to enable current sensing
- Lower AC contact resistance and lower tab temperature
- Superior gate oxide and cosmic ray reliability
- Enable scalable inverter platform development
- Reduces inverter losses by 2/3rd vs. state-of-the-art IGBT solutions
- Operation up to 900ARMS peak current with enhanced products
Applications
- Automotive
- (Hybrid) electric vehicles (H)EVs
- Motor drives
- CAVs
Videos
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| Part Number | Datasheet | Description |
|---|---|---|
| FS01M5R12A7MA2BHPSA1 |  |
Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET |
| FS520R12A8P1BHPSA1 | |
IGBT Modules HybridPACK Drive G2 module : compact six-pack power module (1200V/520A) with enhanced package optimized for hybrid and electric vehicles |
| FS01M3R08A7MA2BHPSA1 | |
IGBT Modules HybridPACK Drive G2 CoolSiC: Compact 750 V/600 A B6-bridge power module optimized for inverter various power classes |
| FS01M3R08A8MA2CHPSA1 | |
Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET |
| FS02MR08A7MA2BHPSA1 | |
IGBT Modules HybridPACK Drive G2 CoolSiC: Compact 750 V/500 A B6-bridge power module optimized for inverter various power classes |
| FS03M1R12A7MA2BHPSA1 | |
IGBT Modules HybridPACK Drive G2 CoolSiC: Compact 1200 V/300 A B6-bridge power module optimized for inverter various power classes |
| FS01MR08A8MA2CHPSA1 | |
Discrete Semiconductor Modules HybridPACK Drive G2 module with SiC MOSFET |
| FS410R12A7P1BHPSA1 | |
MOSFET Modules HybridPACK Drive G2 module |
| FS1000R08A7P3BHPSA1 | |
MOSFET Modules HybridPACK Drive G2 module |
| FS1150R08A8P3CHPSA1 | |
Discrete Semiconductor Modules HybridPACK Drive G2 module |