FTDI FT600/FT601 USB 3.0 to FIFO Interface Bridge Chips
FTDI FT600/FT601 USB 3.0 to FIFO Interface Bridge Chips are high-performance chips used in applications that require high data throughput like imaging devices and Multi-Channel FIFO ADC or DAC devices etc. The FIFO interface can support multi-voltage I/O (1.8V, 2.5V, 3.3V) and operating frequencies of 66.67MHz or 100MHz. 100MHz only for 2.5V and 3.3V.
There are 2 different proprietary synchronous bus protocols supported. One FIFO bus protocol is called the "Multi-Channel FIFO" bus protocol and the other is the "245 Synchronous FIFO" bus protocol. The latter being an extension of the interface introduced in the FT232H/FT2232H devices.
Features
Supports USB 3.0 Super Speed (5Gbps)/USB 2.0 High Speed (480Mbps)/USB 2.0 Full Speed (12Mbps) transfer.
Supported USB Transfer Type: Control/Bulk/Interrupt
Up to 8 configurable endpoints (PIPEs).
Supports 2 parallel slave FIFO bus protocols 245 and FIFO mode, FT601 with 32 bit parallel interface has a data bursting rate up to 400MB/s.
Supports 4 IN channels and 4 OUT channels on FIFO bus connectivity.
Built-in 16kB FIFO data buffer RAM.
Supports Remote Wakeup capability.
Supports multi voltage I/O: 1.8V, 2.5V and 3.3V.
Configurable GPIO support.
Internal LDO 1.0V regulator.
Integrated power-on-reset circuit.
User programmable USB descriptors.
Supports Battery Charging spec. BC1.2.
Available as FT600-16bit/FT601-32bit FIFO interface.
Industrial operating temperature range: -40 to 85⁰C.
Available in compact Pb-free QFN-76(32bit) and QFN-56(16bit) packages (both RoHS compliant).
The UMFT60xx is an evaluation/development module with either FMC(LPC)/HSMC connectors for interfacing FTDI's FT60x USB 3.0 Superspeed IC with external hardware. The UMFT60xx allows for bridging a FIFO bus to a USB3.0 host and evaluating the functionality of the FT60x.
As a daughter card, the UMFT60xx must work with a FIFO master board which has either a FMC or HSMC connector. There are 4 models which provide different FIFO bus interfaces and data bit widths.
The modules are designed such that they can plug into most FPGA development platforms supplied by vendors such as Xilinx or Altera.
Features
Supports USB 3.0 Super Speed (5Gbps)/USB 2.0 High Speed (480Mbps)/USB 2.0 Full Speed (12Mbps) transfer
4 IN channels and 4 OUT channels on FIFO bus connectivity
Supports multi voltage I/O: 1.8V, 2.5V and 3.3V
High speed connector for FIFO bus: FMC(Field Programmable Mezzanine Card) or HSMC (High Speed Mezzanine Card)
FMC connector is compatible with most Xilinx FPGA reference design boards
HSMC is compatible with most Altera FPGA reference design boards
Multi powered options: external DC powered, BUS powered, FMC/HSMC powered
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