THERM-A-GAP® GEL 50TBL 5W/m-K Thin Bond Line Gels

Parker Chomerics THERM-A-GAP® GEL 50TBL Thin Bond Line Gels are single-component, fully cured, dispensable gels featuring 5.0W/m-K thermal conductivity and a minimum bond line thickness of 0.002" (0.05mm). The high-performance thermal interface material conducts heat away from electronics to a heat sink or enclosure at ultra-thin bond lines. The 50TBL gels require no mixing or secondary curing, enabling easy application and possible rework. Parker Chomerics THERM-A-GAP GEL 50TBL Thin Bond Line Gels need only ultra-low compressive force to conform under assembly pressure, resulting in minimal stress to components, solder joints, and leads. The gels are suitable for an operating temperature range of -67°C to +392°C.

Results: 2
Select Image Part #
 Mfr.
Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity.
Qty. RoHS ECAD Model Product
Thermal Conductivity
Color
Minimum Operating Temperature
Maximum Operating Temperature
Thickness
Flammability Rating
Series
Parker Chomerics Thermal Interface Products Thermal Conductive Gel, Dispensable, One-Component, Fully-Cured, 5W/m-K, 10CC
Datasheet
45Expected 19/11/2026
£34.59
£31.70
£31.63
£28.15
View
Min.: 1
Mult.: 1
Thermal Paste / Thermal Grease / Thermal Gel 5 W/m-K Gray - 40 C + 150 C 0.05 mm UL 94 V-0 GEL 50TBL
Parker Chomerics Thermal Interface Products Thermal Conductive Gel, Dispensable, One-Component, Fully-Cured, 5W/m-K, 30CC
Datasheet
Non-Stocked Lead-Time 5 Weeks
£34.73
£33.46
£32.59
£32.58
Min.: 40
Mult.: 1
GEL 50TBL