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HEF4094BTTJ

Name: Nexperia HEF4094BTTJ
Brand: Nexperia
SKU: 771-HEF4094BTTJ
Price: 0.4 GBP
Availability: InStock

Images are for reference only
See Product Specifications

Mouser No:

771-HEF4094BTTJ

Mfr. No:

HEF4094BTTJ

Mfr.:

Nexperia

Description:

Counter Shift Registers HEF4094BTT/SOT403/TSSOP16

Datasheet:

HEF4094BTTJ Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

In Stock: 4,173

Stock:: 4,173 Can Dispatch Immediately

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Factory Lead Time:: 14 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

£-.--

Ext. Price:

£-.--

Est. Tariff:

Packaging:

Full Reel (Order in multiples of 2500)

Cut Tape

MouseReel™ (+£3.50)

Pricing (GBP)

Qty.	Unit Price	Ext. Price
Cut Tape / MouseReel™ ^†
	£0.405	£0.41
	£0.254	£2.54
	£0.221	£22.10
	£0.205	£41.00
Full Reel (Order in multiples of 2500)
	£0.203	£507.50
	£0.164	£820.00

† A MouseReel™ fee of £3.50 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Nexperia
Product Category:	Counter Shift Registers
RoHS:
Package/Case:	TSSOP-16
Packaging:	Reel
Packaging:	Cut Tape
Packaging:	MouseReel
Brand:	Nexperia
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Counter Shift Registers
Factory Pack Quantity:	2500
Subcategory:	Logic ICs
Part # Aliases:	935302209118
Unit Weight:	63.730 mg

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Datasheet

HEF4094BTTJ Datasheet (PDF)

PCN

CNHTS:: 8542399000
CAHTS:: 8542390000
USHTS:: 8542390090
JPHTS:: 854239099
TARIC:: 8542399000
MXHTS:: 8542399999
ECCN:: EAR99

Logic

NXP Semiconductors Logic portfolio consists of the industry’s smallest, leadless DQFN package for gates, octals, and MSI functions simplifying PCB routing, and the world’s smallest MicroPak™ and Diamond™ packages for single-, dual-, and triple-gate logic. We NXP continually invests in new process and package technologies, as well as new packaging facilities, focus on increasing performance, lowering power consumption, and reducing size and have the largest portfolio of dedicated Q100 devices.