Die Sensor Interface

Results: 95
Select Image Part # Mfr. Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Type Interface Type Supply Voltage - Max Supply Voltage - Min Operating Supply Current Minimum Operating Temperature Maximum Operating Temperature Mounting Style Package/Case ESD Protection Packaging
Renesas Electronics ZSSC3123AA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3123AI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 9,000
Mult.: 9,000

Capacitive Sensor Signal Conditioner with Digital Output I2C, Serial, SPI 5.5 V 2.3 V 100 uA - 40 C + 125 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3135BA1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3135BE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Waffle
Renesas Electronics ZSSC3154BA1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,700
Mult.: 2,700

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3154BA1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3154BE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2,700
Mult.: 2,700

SMD/SMT Die
Renesas Electronics ZSSC3224BI1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 18 Weeks
Min.: 16,500
Mult.: 16,500

Sensor Signal Conditioner I2C, SPI 3.6 V 1.68 V 1 mA - 40 C + 85 C SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BC1B
Renesas Electronics Sensor Interface WAFER UNSAWN, 304 Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BC2B
Renesas Electronics Sensor Interface OPN - WAFER UNSAWN, 725 Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BC5B
Renesas Electronics Sensor Interface WAFER UNSAWN, 304U, WITH INKING Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3230BI6B
Renesas Electronics Sensor Interface ZSSC3230BI6B (WAFER UNSAWN, 725, WITH IN Non-Stocked Lead-Time 18 Weeks
Min.: 21,787
Mult.: 21,787

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC3018BA2C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 16,000
Mult.: 16,000

Sensor Signal Conditioner I2C/SPI 3.6 V 1.68 V 1 mA - 40 C + 125 C SMD/SMT Die Tray
Renesas Electronics ZSSC3135BE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 2,800
Mult.: 2,800

Sensor Signal Conditioner for Piezoresistive Bridge Sensors I2C 5.5 V 4.5 V 5.5 mA - 40 C + 150 C SMD/SMT Die Tray
Renesas Electronics ZSSC3154BE1B
Renesas Electronics Sensor Interface WAFER (UNSAWN) - BOX Non-Stocked Lead-Time 24 Weeks
Min.: 2,700
Mult.: 2,700

SMD/SMT Die Wafer Pack
Renesas Electronics ZSSC3154BE1D
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

SMD/SMT Die Waffle
Renesas Electronics ZSSC3218BI1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 18 Weeks
Min.: 16,500
Mult.: 16,500

SMD/SMT Die Tray
Renesas Electronics ZSSC4151CE1C
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,347
Mult.: 4,347

SMD/SMT Die Tray
Renesas Electronics ZSSC4161DE1B
Renesas Electronics Sensor Interface UNSAWN WAFER IN WAFER BOX Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4161DE1B-APB
Renesas Electronics Sensor Interface TESTED WAFER -CFG 4161_0500_03 V2.2 Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Gel Pack
Renesas Electronics ZSSC4161DE1C
Renesas Electronics Sensor Interface SAWN WAFER ON WAFER FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Tray
Renesas Electronics ZSSC4161DE1C-APB
Renesas Electronics Sensor Interface TESTED DIE, SAWN ON FOIL -CFG 4161_0500_ Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Tray
Renesas Electronics ZSSC4165DE1D-ES
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - WAFFLE PACK Non-Stocked Lead-Time 24 Weeks
Min.: 1
Mult.: 1

Sensor SMD/SMT Die Waffle
Renesas Electronics ZSSC4169DE1C-APC
Renesas Electronics Sensor Interface DICE (WAFER SAWN) - FRAME Non-Stocked Lead-Time 24 Weeks
Min.: 4,730
Mult.: 4,730

SMD/SMT Die Tray