Each IC & Component Sockets

Results: 121
Select Image Part # Mfr. Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Number of Rows Type Pitch Termination Style Contact Plating Row Spacing Minimum Operating Temperature Maximum Operating Temperature Packaging
3M Electronic Solutions Division IC & Component Sockets Textool QFN .4MM,56P EVEN ROW,W/THRML PI 11In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,64P EVEN ROW,W/THRML PI 21In Stock
20Expected 15/06/2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 64 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets .1" INLINE ZIP STRIP Socket 10 Contct Qt 57In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 10 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,24P EVEN ROW,W/THRML PI 24In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 24 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 0.100" DIP SOCKET 48 Contact Qty. 55In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 48 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 8P DUAL WIPE DIPSKT 6,049In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 8P DUAL WIPE DIPSKT 23,649In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 14P DUAL WIPE DIPSKT 11,157In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 14 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 16P DUAL WIPE DIPSKT 5,971In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 16 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 18P DUAL WIPE DIPSKT 8,780In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 24P DUAL WIPE DIPSKT 4,223In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 28P DUAL WIPE DIPSKT 4,736In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 32P DUAL WIPE DIPSKT 2,397In Stock
Min.: 1
Mult.: 1

DIP / SIP Sockets 32 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC & Component Sockets 52P PLCC SOCKET SMT W/LOCATION POSTS 81In Stock
1,104Expected 20/07/2026
Min.: 1
Mult.: 1

PLCC Sockets 52 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 15.24 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 8 Leads 48In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 14 Contact Qty. 19In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 14 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 14 Leads 1In Stock
20Expected 03/09/2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 14 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets RECPT FOR DIP SOCKET 16 Contact Qty. 19In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets Textool QFN .5MM,16P EVEN ROW,W/THRML PI 6In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads 7In Stock
30Expected 10/08/2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 16 Leads 29In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets .1" INLINE ZIP STRIP Socket 20 Contct Qty 4In Stock
20Expected 10/09/2026
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 20 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets BURN-IN SOIC SOCKET 20 Leads 18In Stock
Min.: 1
Mult.: 1

Test & Burn-In Sockets 20 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC & Component Sockets 0.100" DIP SOCKET 24 Contact Qty. 28In Stock
40Expected 18/09/2026
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 24 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC & Component Sockets 0.100" DIP SOCKET 24 Contact Qty. 19In Stock
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 24 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each