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1-2376820-2

Name: TE Connectivity 1-2376820-2
Brand: TE Connectivity
SKU: 571-1-2376820-2
Price: 186.6 GBP
Availability: OutOfStock

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Mouser No:

571-1-2376820-2

Mfr. No:

1-2376820-2

Mfr.:

TE Connectivity

Description:

IC & Component Sockets LGA7529 TFLM ASSEMBLY W/ COVER

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

1-2376820-2 Datasheet

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Learn more about TE Connectivity 1-2376820-2

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 15 Weeks Estimated factory production time.

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Minimum: 1200 Multiples: 1200

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£186.60	£223,920.00
3,600	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	IC & Component Sockets
RoHS:
Product:	Accessories
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 100 C
Series:	LGA7529
Packaging:	Tray
Accessory Type:	Connector Hardware
Brand:	TE Connectivity
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Housing Material:	Stainless Steel
Product Type:	IC & Component Sockets
Factory Pack Quantity:	8
Subcategory:	IC & Component Sockets

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Datasheet

1-2376820-2 Datasheet

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USHTS:: 8473302000
TARIC:: 8536901000
ECCN:: EAR99

LGA7529 Socket & Hardware

TE Connectivity's (TE) LGA7529 Socket and Hardware include a socket for next-generation server processors, providing more connections between the motherboard and the processor. This socket features 7529 pins, delivering increased performance and data bandwidth to support top processor multi-core architecture and high-throughput workloads. Reliable and easy installation is provided by these products, which are qualified and tested for durability and environmental resistance, including vibration and shock. LGA7529 hardware includes back plates, bolster plates, carriers, and socket covers. TE LGA7529 Socket and Hardware are suitable for networking equipment, Cloud service, servers, switches, edge computing, hyperscale, and artificial intelligence (AI).