200-LPAF Board to Board & Mezzanine Connectors

Results: 114
Select Image Part # Mfr. Description Datasheet Availability Pricing (GBP) Filter the results in the table by unit price based on your quantity. Qty. RoHS ECAD Model Product Number of Positions Pitch Number of Rows Termination Style Mounting Angle Stack Height Current Rating Voltage Rating Maximum Data Rate Minimum Operating Temperature Maximum Operating Temperature Contact Plating Contact Material Housing Material Series Packaging
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 425
Mult.: 425
Reel: 425
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 5 Weeks
Min.: 500
Mult.: 500
Reel: 500
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 5 Weeks
Min.: 500
Mult.: 500
Reel: 500
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 6 Weeks
Min.: 350
Mult.: 350
Reel: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 550
Mult.: 550
Reel: 550
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 5 Weeks
Min.: 550
Mult.: 550
Reel: 550
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 350
Mult.: 350
Reel: 350
Headers 1.27 mm (0.05 in) Solder Straight 2.2 A 250 V - 55 C + 125 C Gold Copper Alloy Liquid Crystal Polymer (LCP) LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 500
Mult.: 500
Reel: 500
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 650
Mult.: 650
Reel: 650

LPAF Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 4 Weeks
Min.: 550
Mult.: 550
Reel: 550
Reel
Samtec Board to Board & Mezzanine Connectors .050" LP Array(trademark) High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked
Min.: 325
Mult.: 325
Reel: 325
Reel
Samtec LPAF-40-03.0-S-06-1-K-TR
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 550
Mult.: 550
Reel: 550
Reel
Samtec LPAF-30-03.0-S-06-1-K-TR
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 11 Weeks
Min.: 550
Mult.: 550
Reel: 550
Reel
Samtec Board to Board & Mezzanine Connectors .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array Non-Stocked Lead-Time 3 Weeks
Min.: 350
Mult.: 350
Reel: 350
No
LPAF Reel