CD-02-05-C-18

Wakefield Thermal
567-CD-02-05-C-18
CD-02-05-C-18

Mfr.:

Description:
Thermal Interface Products ulTIMiFlux Dielectric Phase Change, Chipset Pad 0.689" x 0.689", No Hole

Datasheet:
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Learn more about Wakefield Thermal CD-02-05-C-18

In Stock: 857

Stock:
857 Can Dispatch Immediately
Factory Lead Time:
8 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 857 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£1.25 £1.25
£1.13 £11.30
£1.08 £27.00
£1.04 £52.00
£1.00 £100.00
£0.943 £235.75
£0.89 £445.00
£0.778 £778.00
£0.654 £1,635.00

Product Attribute Attribute Value Select Attribute
Wakefield Thermal
Product Category: Thermal Interface Products
RoHS:  
Phase Change Materials
Thermal Pad
Non-standard
Phase Change Compound
9.2 kVAC
Orange
+ 60 C
0.689 in
0.689 in
0.076 mm
100 psi
UL 94 V-0
CD
Brand: Wakefield Thermal
Designed for: Chipset
Product Type: Thermal Interface Products
Factory Pack Quantity: 500
Subcategory: Thermal Management
Tradename: ulTIMiFlux
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Attributes selected: 0

Datasheet

USHTS:
3920992000
ECCN:
EAR99

ulTIMiFlux Thermal Material

Wakefield Thermal ulTIMiFlux Thermal Material offers high performance, cost-effectiveness, configurability, and custom sizes for thermal system needs. Thermal Interface Material (TIM) is a secondary material installed between the heat sink and the device and is designed to improve the thermal transfer to the heat sink. The Wakefield Thermal line of dielectric phase change thermal materials are intended to fill voids between a device and the heat sink. The ulTIMiFlux material utilizes a polyimide film to act as a thermally conductive carrier to deliver uniform thickness coating of phase-change thermal compound on both sides. These materials are an effective drop-in-place solution that makes an excellent replacement for thermal greases.

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