LM75BIM-5/NOPB
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Description:
Board Mount Temperature Sensors Digital Temp Sensor & Thermal Watchdog
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- Alternate Laser Marking Process Sequence for SOIC package (PDF)
- Product Change Notification (PDF)
- Product Change Notification (PDF)
- Qualification of copper wire as alternate bonding material for selected products in SOIC Package (PDF)
- Qualification of SID# 101380756 Mold Compound for Select SOIC Device(s) (PDF)
- CNHTS:
- 9025199090
- CAHTS:
- 8542390000
- USHTS:
- 8542390090
- JPHTS:
- 854239099
- TARIC:
- 8542399000
- MXHTS:
- 8542399901
- ECCN:
- EAR99
United Kingdom
