DP83869HMRGZT

Texas Instruments
595-DP83869HMRGZT
DP83869HMRGZT

Mfr.:

Description:
Ethernet ICs Extended temperature high-immunity giga A 595-DP83869HMRGZR

ECAD Model:
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In Stock: 1,172

Stock:
1,172 Can Dispatch Immediately
Factory Lead Time:
6 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 250)

Pricing (GBP)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™
£12.55 £12.55
£9.96 £99.60
£9.31 £232.75
£8.61 £861.00
Full Reel (Order in multiples of 250)
£8.25 £2,062.50
£7.95 £3,975.00
£7.92 £7,920.00
† A MouseReel™ fee of £3.50 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable.

Alternative Packaging

Mfr. Part No.:
Packaging:
Reel, Cut Tape, MouseReel
Availability:
In Stock
Price:
£10.69
Min:
1

Similar Product

Texas Instruments DP83869HMRGZR
Texas Instruments
Ethernet ICs Extended temperature high-immunity giga A 595-DP83869HMRGZT

Product Attribute Attribute Value Select Attribute
Texas Instruments
Product Category: Ethernet ICs
RoHS:  
SMD/SMT
VQFN-48
Ethernet Transceivers
10BASE-TE, 100BASE-TX, 1GBASE-T
1 Transceiver
10 Mb/s, 100 Mb/s, 1 Gb/s
MII, RGMII, SGMII
1.8 V
3.45 V
- 40 C
+ 125 C
DP83869HM
Reel
Cut Tape
MouseReel
Brand: Texas Instruments
Moisture Sensitive: Yes
Product Type: Ethernet ICs
Factory Pack Quantity: 250
Subcategory: Communication & Networking ICs
Unit Weight: 109 mg
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CNHTS:
8542399000
USHTS:
8542390090
ECCN:
EAR99

DP83869HM Gigabit Physical Layer (PHY) Transceiver

Texas Instruments DP83869HM Gigabit Physical Layer (PHY) Transceiver has integrated PMD sublayers that support 10BASE-Te, 100BASE-TX, and 1000BASE-T Ethernet protocols. The DP83869 also supports 1000BASE-X and 100BASE-FX Fiber protocols. Optimized for ESD protection, the Texas Instruments DP83869HM exceeds 8kV IEC 61000-4-2 (direct contact). This device interfaces to the MAC layer through Reduced GMII (RGMII) and SGMII. In 100M mode, the device lets the designer use MII for lower Latency. Programmable integrated termination impedance on RGMII/MII helps reduce system BOM.