PCAL9714HN/Q900MP

NXP Semiconductors
771-PCAL9714HNQ900MP
PCAL9714HN/Q900MP

Mfr.:

Description:
Interface - I/O Expanders 14-bit SPI Level Translating I/O Expander with Agile I/O and AEC-Q100 Compliant in HVQFN24 package

ECAD Model:
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In Stock: 5,388

Stock:
5,388 Can Dispatch Immediately
Factory Lead Time:
16 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£1.16 £1.16
£0.871 £8.71
£0.788 £19.70
£0.698 £69.80
£0.656 £164.00
£0.63 £315.00
£0.611 £611.00
£0.61 £2,440.00
Full Reel (Order in multiples of 6000)
£0.571 £3,426.00

Product Attribute Attribute Value Select Attribute
NXP
Product Category: Interface - I/O Expanders
RoHS:  
PCAL9714
SMD/SMT
HVQFN-24
I2C, Serial
With Interrupt
1.1 V
5.5 V
5 MHz
- 40 C
+ 125 C
AEC-Q100
Reel
Cut Tape
2 kV
Brand: NXP Semiconductors
Moisture Sensitive: Yes
Operating Supply Current: 160 mA
Operating Supply Voltage: 1.1 V to 5.5 V
Output Current: 10 mA, 25 mA
Output Type: Open Drain, Push Pull
Product: I/O Expanders
Product Type: I/O Expanders
Factory Pack Quantity: 6000
Subcategory: Interface ICs
Type: General Purpose I/O Expander
Part # Aliases: 935429619528
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Attributes selected: 0

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CNHTS:
8542399000
CAHTS:
8542390000
USHTS:
8542390090
MXHTS:
8542399999
ECCN:
EAR99

PCAL9714 Ultra Low-Voltage 14-bit Expanders

NXP Semiconductors PCAL9714 Ultra Low-Voltage 14-bit Expanders offer remote I/O expansion for microcontroller families via the Serial Peripheral Interface (SPI). These expanders include interface that allows direct connection with the microcontroller operating down to 1.1V. The PCAL9714 14-bit expanders feature integrated Agile I/O, enabling flexible and configurable designs with push-pull or open-drain outputs. These integrated Agile I/O feature interrupt status registers, four different output drive strengths, enable and resistor selectors for pull-up and pull-down resistors, and interrupt mask options. Typical applications include automotive, communication infrastructure, industrial, smart city, and smart home.