90119-2122

Molex
538-90119-2122
90119-2122

Mfr.:

Description:
Headers & Wire Housings C-Grid Term Fem Crp Crp LP Au-F 26/28AWG

ECAD Model:
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In Stock: 6,807

Stock:
6,807 Can Dispatch Immediately
Factory Lead Time:
2 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:

Pricing (GBP)

Qty. Unit Price
Ext. Price
£0.19 £0.19
£0.162 £1.62
£0.145 £3.63
£0.138 £13.80
£0.117 £29.25
£0.116 £116.00
£0.11 £275.00

Similar Product

Molex 90119-0122
Molex
Headers & Wire Housings C-Grid Term Fem Crp 26/28AWG REEL/20000

Product Attribute Attribute Value Select Attribute
Molex
Product Category: Headers & Wire Housings
RoHS:  
Contacts
Cable Mount / Free Hanging
Crimp
Socket (Female)
Gold
90119
C-Grid
Wire-to-Board, Signal
28 AWG to 26 AWG
- 55 C
+ 105 C
Bulk
Brand: Molex
Contact Material: Tin
Product Type: Headers & Wire Housings
Factory Pack Quantity: 1
Subcategory: Headers & Wire Housings
Part # Aliases: 0901192122
Unit Weight: 74 mg
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536900020
USHTS:
8536904000
JPHTS:
8536900002
KRHTS:
8536909010
TARIC:
8536699099
MXHTS:
85369099
BRHTS:
85369090
ECCN:
EAR99

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.