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FF2000UXTR33T2M1BPSA1

Name: Infineon FF2000UXTR33T2M1BPSA1
Brand: Infineon Technologies
SKU: 726-FF2000UXTR33T2M1
Price: 5917.38 GBP
Availability: InStock

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Mouser No:

726-FF2000UXTR33T2M1

Mfr. No:

FF2000UXTR33T2M1BPSA1

Mfr.:

Infineon Technologies

Description:

MOSFET Modules XHP HV

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

FF2000UXTR33T2M1BPSA1 Datasheet (PDF)

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Learn more about Infineon Technologies FF2000UXTR33T2M1BPSA1

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This product may require additional documentation to export from the United States.

In Stock: 4

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Factory Lead Time:: 20 Weeks Estimated factory production time for quantities greater than shown.

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Ext. Price:

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Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£5,917.38	£5,917.38

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Infineon
Product Category:	MOSFET Modules
Delivery Restrictions:	This product may require additional documentation to export from the United States.
RoHS:
Technology:	SiC
Mounting Style:	Screw Mount
Transistor Polarity:	N-Channel
Rds On - Drain-Source Resistance:	2.4 mOhms
Vgs - Gate-Source Voltage:	- 10 V, + 23 V
Vgs th - Gate-Source Threshold Voltage:	3.45 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 175 C
Series:	XHP 2
Packaging:	Tray
Brand:	Infineon Technologies
Configuration:	Dual
Fall Time:	82 ns
Product Type:	MOSFET Modules
Rise Time:	170 ns
Factory Pack Quantity:	1
Subcategory:	Discrete and Power Modules
Tradename:	XHP CoolSiC
Type:	Power Module
Typical Turn-Off Delay Time:	30 ns
Typical Turn-On Delay Time:	480 ns
Vf - Forward Voltage:	4.6 V
Part # Aliases:	FF2000UXTR33T2M1 SP005400736

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Datasheet

FF2000UXTR33T2M1BPSA1 Datasheet (PDF)

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CAHTS:: 8541290000
USHTS:: 8541290065
JPHTS:: 854129000
TARIC:: 8541290000
MXHTS:: 8541299900
ECCN:: 3A228.c

XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules

Infineon Technologies XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules are designed for applications ranging from 1.7kV to 3.3kV, featuring three AC terminals and four DC terminals to maximize current-carrying capabilities. The simple scalability of XHP 2 frame size, owing to the basic modular concept, makes these modules ready for future chip generations and fast-switching devices, enabling low losses. These modules offer low switching losses and high current density, enabled by a low inductive design. Mechanically, the modules provide high power density in a package with a Comparative Tracking Index (CTI) greater than 600, ensuring high creepage and clearance distances. An AlSiC base plate enhances thermal cycling capabilities, making these modules ideal for demanding applications.