FF1000UXTR23T2M1BPSA1

Infineon Technologies
726-FF1000UXTR23T2B1
FF1000UXTR23T2M1BPSA1

Mfr.:

Description:
MOSFET Modules XHP2 module with CoolSiC Trench MOSFET and NTC

Lifecycle:
New Product:
New from this manufacturer.
ECAD Model:
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In Stock: 3

Stock:
3 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
£-.--
Ext. Price:
£-.--
Est. Tariff:
This Product Ships FREE

Pricing (GBP)

Qty. Unit Price
Ext. Price
£3,271.47 £3,271.47

Product Attribute Attribute Value Select Attribute
Infineon
Product Category: MOSFET Modules
RoHS:  
SiC
Screw Mount
N-Channel
2 Channel
2.3 kV
2000 A
2.88 mOhms
- 10 V, + 23 V
5.15 V
+ 150 C
20 mW
XHP 2
Tray
Brand: Infineon Technologies
Configuration: Dual
Fall Time: 105 ns
Height: 40 mm
Length: 144 mm
Product: MOSFET Module
Product Type: MOSFET Modules
Rise Time: 100 ns
Factory Pack Quantity: 1
Subcategory: Discrete and Power Modules
Tradename: CoolSiC
Type: CoolSiC Trench MOSFET
Typical Turn-Off Delay Time: 375 ns
Typical Turn-On Delay Time: 225 ns
Vf - Forward Voltage: 5 V
Width: 99.8 mm
Part # Aliases: FF1000UXTR23T2M1 SP005729048
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Attributes selected: 0

CAHTS:
8541210000
USHTS:
8541210095
JPHTS:
854121000
TARIC:
8541210000
MXHTS:
8541210100
ECCN:
EAR99

XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules

Infineon Technologies XHP™ 2 CoolSiC™ MOSFET Half-Bridge Modules are designed for applications ranging from 1.7kV to 3.3kV, featuring three AC terminals and four DC terminals to maximize current-carrying capabilities. The simple scalability of XHP 2 frame size, owing to the basic modular concept, makes these modules ready for future chip generations and fast-switching devices, enabling low losses. These modules offer low switching losses and high current density, enabled by a low inductive design. Mechanically, the modules provide high power density in a package with a Comparative Tracking Index (CTI) greater than 600, ensuring high creepage and clearance distances. An AlSiC base plate enhances thermal cycling capabilities, making these modules ideal for demanding applications.