It appears you have JavaScript disabled within your browser. Some functions on this page will not work unless you log in.

See an Error?

ATS-59007-C1-R0

Name: Advanced Thermal Solutions ATS-59007-C1-R0
Brand: Advanced Thermal Solutions
SKU: 984-ATS-59007-C1-R0
Price: 17.22 GBP
Availability: InStock

Images are for reference only
See Product Specifications

Mouser No:

984-ATS-59007-C1-R0

Mfr. No:

ATS-59007-C1-R0

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 35mm Comp, 35x46x16mm

Datasheet:

ATS-59007-C1-R0 Datasheet (PDF)

ECAD Model:

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about the ECAD Model.

More Information

Learn more about Advanced Thermal Solutions ATS-59007-C1-R0

In Stock: 100

Stock:: 100 Can Dispatch Immediately

An unexpected error occurred. Please try again later.
Factory Lead Time:: 13 Weeks Estimated factory production time for quantities greater than shown.

Quantities greater than 100 will be subject to minimum order requirements.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

£-.--

Ext. Price:

£-.--

Est. Tariff:

Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£17.22	£17.22
	£15.24	£152.40
	£14.51	£290.20
	£13.99	£699.50
	£13.69	£1,369.00
	£12.71	£2,542.00
	£12.45	£6,225.00

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sink Assemblies
Designed for:	BGA
Mounting Style:	Snap On
Heatsink Material:	Aluminum
Fin Style:	Angled Fin
Thermal Resistance:	2.42 C/W
Length:	46 mm
Width:	35 mm
Height:	16 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	maxiGRIP HS ASM - Custom
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	maxiFLOW maxiGRIP
Type:	Component

Products found:

To show similar products, select at least one checkbox

Select at least one checkbox above to show similar products in this category.

Attributes selected: 0

Filter Document:

Datasheet

ATS-59007-C1-R0 Datasheet (PDF)

Test/Quality Data

Certificate of RoHS and REACH 205 Compliance (PDF)

This functionality requires JavaScript to be enabled.

CNHTS:: 7616991090
CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. This heat sink design provides high thermal performance for the physical volume that they occupy as compared to other heat sink designs. The maxiFLOW heat sinks feature three attachment methods: maxiGRIP™, thermal tape, or push pin. The maxiGRIP™ heat sink attachment applies steady, even pressure to the component and does not require holes in the PCB. The thermal tape mounts the heat sink using a thermally conductive adhesive strip, while the push pin attachment requires holes in the PCB to anchor the heat sink.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.