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4P02-2D02-DA

Name: 3M 4P02-2D02-DA
Brand: 3M Electronic Solutions Division
SKU: 517-4P02-2D02-DA
Price: 6.39 GBP
Availability: OutOfStock

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Mouser No:

517-4P02-2D02-DA

Mfr. No:

4P02-2D02-DA

Mfr.:

3M Electronic Solutions Division

Description:

PC/104 Connectors 64P SOLDER TAIL 12MM PC104

Datasheet:

4P02-2D02-DA Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 12 Weeks Estimated factory production time.

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Pricing (GBP)

Qty.	Unit Price	Ext. Price
	£6.39	£8,498.70

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	3M
Product Category:	PC/104 Connectors
RoHS:
Product:	Stackthrough
Number of Positions:	64 Position
Termination Style:	Solder Tail
Housing Material:	Polyester Nylon
Contact Material:	Phosphor Bronze
Brand:	3M Electronic Solutions Division
Packaging:	Each
Pitch:	2.54 mm
Product Type:	PC / 104 Connectors
Factory Pack Quantity:	665
Subcategory:	Backplane Connectors
Part # Aliases:	05111559374 7010500442 70010028093
Unit Weight:	9.878 g

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Datasheet

4P02-2D02-DA Datasheet (PDF)

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CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536699099
MXHTS:: 85366999
BRHTS:: 85366990
ECCN:: EAR99

PC104 Connectors

3M PC104 Connectors feature a simple contact design to accommodate many standoff heights, including standard PC104 pin-and-socket connectors with rugged and reliable 64- and 40-contact male/female headers. The 2.54mm pitch PC104 connectors are available as primary connectors specified by PC/104: 8-bit J1/P1 and 16-bit J2/P2 in both stack-through and non-stack-through options.

PC104 & PC104 Plus Connectors

3M PC104 & PC104 Plus Connectors are designed to meet the specifications of PC/104 Embedded-PC Modules in Embedded Systems Applications. 3M offers the PC104 8-bit J1/P1 and 16-bit J2/P2 Connectors in both stack-through and non-stack-through versions with solder tail termination. The PC104 Plus Connectors' offering incorporates the PCI bus within the PCI/104 form factor, and includes the J3/P3 32-bit non-stack-through module with solder tail termination and the stack-through module with press-fit tail termination. The stack-through design meets the compact space requirements of embedded applications and provides rugged performance against shock and vibration. In addition, the self-stacking bus eliminates the need, cost, and bulk of backplanes and card cages while the relaxed bus drive (6mA) lowers power consumption (to 1W to 2W per module) and minimizes component count.